Carrier_BT807042_SOT23-3_v LCP

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Carrier for electronic components

Article No.: 78 01 030 0006

Carrier for electronic components

Interconnection

PCB assembly (SMD)

Liquid crystal polymer (LCP)

Surface (contacts): Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)

Identification

Specification	Interconnection
Element	Carrier for electronic components
Series	3D-MID
Category	Surface Mount Device
Features	Other materials or trace layouts on request!

Version

Fixing	PCB assembly (SMD)
Pack contents	Tape & reel
	1200 pieces on reel
	Lower quantities available on request!

Technical characteristics

Storage temperature	-40 ... +125 °C
Operating temperature	-40 ... +125 °C

Material properties

Length	8 mm
Width	7 mm
Height	4.2 mm
Surface (contacts)	Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
RoHS	compliant
Material	Liquid crystal polymer (LCP)
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained

Commercial data

eCl@ss	27469090 PCB connection technology (other, unspecified)
Net weight	1.224 g
Packaging size	600
Country of origin	Switzerland
European customs tariff number	85340019
GTIN	5713140277397
ETIM	EC002637